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M14C32串行EEPROM管芯简介
消耗积分:2 |
格式:rar |
大小:333 |
2009-05-19
吴湛
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PRODUCT M14C32
n WAFER SIZE 152 mm (6 inches)
n DIE IDENTIFICATION M14C32KA_R
n DIE SIZE (X x Y) 2040 x 2355 μm
n SCRIBE LINE 100.5 x 101.7 μm
n PAD OPENING 100 x 100 μm
DIE LAYOUT
n DI Die Identification (at the position shown in Figure 1)
n C1, C2, C3, C5, C7 Pad contacts to the ISO pins (at the positions shown in Figure 1)
n C4, C6, C8 These ISO pins do not appear on the M14C32 die
n NC This pad, shown in Figure 1, is Not Connected
Pad locations are measured relative to the die centre (where X and Y are respectively the horizontal and
vertical axis, measured in μm).
n WAFER SIZE 152 mm (6 inches)
n DIE IDENTIFICATION M14C32KA_R
n DIE SIZE (X x Y) 2040 x 2355 μm
n SCRIBE LINE 100.5 x 101.7 μm
n PAD OPENING 100 x 100 μm
DIE LAYOUT
n DI Die Identification (at the position shown in Figure 1)
n C1, C2, C3, C5, C7 Pad contacts to the ISO pins (at the positions shown in Figure 1)
n C4, C6, C8 These ISO pins do not appear on the M14C32 die
n NC This pad, shown in Figure 1, is Not Connected
Pad locations are measured relative to the die centre (where X and Y are respectively the horizontal and
vertical axis, measured in μm).
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