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在包装0.4mm封装PCB装配指南（POP）包_第二部分
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2024-05-13
刘先生
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This application report is the second of two parts. Part I covers the main PCB design guidelines. The design of the bottom board to which the OMAP35xx processor is mounted dominates the PoP failure
mechanisms. Be sure to read and apply the guidelines in Part I before beginning PoP assembly.
mechanisms. Be sure to read and apply the guidelines in Part I before beginning PoP assembly.
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