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WP208-倒装片封装基板焊接问题

消耗积分:0 | 格式:pdf | 大小:61 KB | 2012-02-17

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Alpha particle emission in close proximity to thedevice circuitry is minimized by following Xilinxlow alpha solder requirements on package substratepads. One flip-chip packaging vendor’s failure tocomply with these requirements has resulted incontamination by high alpha solder causing possiblesoft errors due to flipped device configuration bits.This white paper provides an overview on solderingmaterial, describes the specific soldering problem,and offers some solutions.
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